Page 1 - october_preview092618.indd
P. 1

TAP TIMES™                                                   IC Test, Assembly, Packaging
                 October 2018, Volume 9, Number 10                         & Emerging Technologies





              The evolution of sockets from DIPs to WLCSPs, p. 3




                       New fabs to invest over $23 billion, p. 23





                          The promise of liquid electronics, p. 38









                 Tariffs will

              grow China’s

                  domestic

               market, p. 47

























                                                                                  Photo: Port of Oakland
   1   2   3   4   5   6