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HBP tap tmes advert _Layout 1  25/03/2013  08:45  Page 1




               New Horizons in





               Bond Testing










               The Nordson DAGE 4000Plus is the most advanced

               bondtester on the market, representing the
               industry standard in bond testing.















               Data Integrity
               Developed by the world leader in bond testing technology,
               the 4000Plus offers unsurpassed accuracy and repeatability
               of data providing complete confidence in results.





               Hot Bump/Pin Pull on the 4000Plus
               A unique patent protected technique for attaching
               a probe to solder bumps or paste and performing
               a pull test in accordance with the IPC standard
               IPC9708 pad cratering testing for surface mount
               and printed board assemblies.
               The 4000Plus HBP application is achieved by simply selecting a specialized
               load cartridge which can be programmed to apply a temperature-time reflow
               profile to individual bumps/bonds using a probe.  Pre-heating, soak, rate of
               rise, liquidus and cooling are all integrated into the 4000Plus Paragon ™ software
               for easy on screen profiling and control. A selection of standard probe sizes
               are available with custom tips available on request.



                SEE US AT BOOTH 5744, NORTH HALL, SEMICON WEST




               www.nordsondage.com | globalsales@nordsondage.com
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