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TM
                           TAP TIMESTM
                            Device Test, Assembly, Packaging & Emerging Technologies

                                         May-June 2020 - Volume 11, Number 5




                  They all want to be Silicon Valley


                                                                                                 page 3




                   Trade show in-place
                     for SEMICON West

                                            page 20










































                     TSMC plans advanced wafer fab for Arizona
                                                                                           page 25

      Chip assembly & packaging providers sustain upward trend in Q120

                                                                                                          page 48


                      BETTER BONDING
     BIG DUTY                                                              OFF THE SHELF




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