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Micross USAF Ad.pdf   1   11/4/2016   4:07:43 PM


           ONE SOURCE.                                         • Bare Die & Wafers, 30+ Manufacturers


                                                               • Wafer Bumping & Wafer Level Packaging
           ONE SOLUTION.                                       • Silicon Substrate & 3D Integration



                                                               • Packaging & Assembly

                                                               • Electrical Screen From Diodes To The

                                                                  Most Complex FPGAs

                                                               • Complete Device Characterization

                                                               • Level I & Level II Qualification

                                                               • Reballing, Lead Attach & Column Attach

                                                               • Products: SMD/5962, Hi-Rel Memory,

                                                                   Analog & Power, Retail+




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           For  over  35  years,  Micross  has  been  committed  to
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           delivering mission-critical best-in-class products and
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           services to our global Aerospace & Defense partners.
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                  Micross delivers the most
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              complete hi-rel microelectronic
    CMY
                  solutions in the industry.
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            www .micross.com










                               onesource@micross.com
                              1.855.4COMPONENTS



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