Page 2 - july062519_linkedpreview.indd
P. 2

July 2019

        Does the Cypress-Infi neon deal signal more             25-Sensors, actuators show record growth
        M&A activity? Editor Ron Iscoff, 3                      27-IPC urges no tariffs for Canada, Mexico
                                                                28-Packaging, test revenues may show decline
        MIT fi nds do-it-yourself nanotube ingredients,         30-Reality check for China’s IC production hype
        13                                                      31-Wayne Pfaff, Plastronics founder succumbs
                                                                32-Decline for personal computing devices
        Company Billboard, 18-19                                33-Raytheon, UTC agree to “merger of equals”
                                                                34-NAND Flash prices fell “nonstop”
                                                                36-Comm chips will overtake computer ICs
        Advertisers, Events, 26                                 39-Harvard will steer quantum behavior efforts
                                                                41-Broadcom, Bosch top MEMS providers
        Packaging, test revenues may show decline,              43-Global fab equipment spending to rebound
        25                                                      44-Intel will acquire Barefoot Networks
                                                                45-Chip faker gets 46-month prison term
        Perovskite development gains may help                   46-DRAM price decline widens
        solar cell development, 37                              46-Survey: U.S. companies overpay for talent
                                                                47-Advanced packaging forecast: $42.8B by 2025
                                                                47-SEMI MEMS, Sensors & Imaging set for France
        11-Broadcom co-founder gives UCLA $100 million
        12-Georgia Tech cooling system may go commercial        EndPoints:  Missed by inches: The U.S.
        16 -DoE offers $75M to advanced physics                 has almost become metric twice, Ron
        17-Global AR/VR spending to reach $160B                 Iscoff, 48
        19-Smart home devices will drive growth                   Copyright © 2019 Test, Assembly & Packaging TIMES
        20-$3.7 billion market seen for power packaging
        21-Georgia Tech to host sustainability conference
        22-U.S. chip companies dominate world market                               Advertisement
        23-Global smartphone sales declined                          Air-CavityQFN?
        24-Commerce Dept. gives Huawei “exemptions”

                 Visit us on our website

                                      in the Test Socket World :

                                      E-tec Interconnect is
                                      pleased to present its
                                      new Clamshell Open Top Socket

                                      • High reliability up to 500k insertion cycles
                                      • High frequency up to 27 GHz in pogo pin (up to 40GHz validated, with
                                        Elastomeric contact technology)

                                      • Thru-hole technology, SMT, Solderless Type
                                        Also pluggable into adapter MiniGridSocket series (see E-tec catalog TS01)
                                      • All kinds of packages, even your latest special custom packages

                Flat Pack      PGA         LGA      Ceramic spatial   LCC           BGA      QFN / Power QFN  Custom
                  E-tec Interconnect AG, USA: Mr. Jared Wilson, TopLine,, 1-800-776-9888
            E-tec Interconnect AG, Mr. Bud Kundich, Los Altos CA 94024, USA, Phone : +1 408.746.2800, E-mail :
                            EP Patents 0897655, 1385011, 0829188, US Patents 6249440, 6190181, 6390826 and Patents in other countries

          E-tec Inserat Socket 2015 190x127mm US.indd   1                                                  18.06.15   10:06
   1   2   3   4   5   6   7