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July 2019


        Does the Cypress-Infi neon deal signal more             25-Sensors, actuators show record growth
        M&A activity? Editor Ron Iscoff, 3                      27-IPC urges no tariffs for Canada, Mexico
                                                                28-Packaging, test revenues may show decline
        MIT fi nds do-it-yourself nanotube ingredients,         30-Reality check for China’s IC production hype
        13                                                      31-Wayne Pfaff, Plastronics founder succumbs
                                                                32-Decline for personal computing devices
        Company Billboard, 18-19                                33-Raytheon, UTC agree to “merger of equals”
                                                                34-NAND Flash prices fell “nonstop”
                                                                36-Comm chips will overtake computer ICs
        Advertisers, Events, 26                                 39-Harvard will steer quantum behavior efforts
                                                                41-Broadcom, Bosch top MEMS providers
        Packaging, test revenues may show decline,              43-Global fab equipment spending to rebound
        25                                                      44-Intel will acquire Barefoot Networks
                                                                45-Chip faker gets 46-month prison term
        Perovskite development gains may help                   46-DRAM price decline widens
        solar cell development, 37                              46-Survey: U.S. companies overpay for talent
                                                                47-Advanced packaging forecast: $42.8B by 2025
                                                                47-SEMI MEMS, Sensors & Imaging set for France
        NEWS
        11-Broadcom co-founder gives UCLA $100 million
        12-Georgia Tech cooling system may go commercial        EndPoints:  Missed by inches: The U.S.
        16 -DoE offers $75M to advanced physics                 has almost become metric twice, Ron
        17-Global AR/VR spending to reach $160B                 Iscoff, 48
        19-Smart home devices will drive growth                   Copyright © 2019 Test, Assembly & Packaging TIMES
        20-$3.7 billion market seen for power packaging
        21-Georgia Tech to host sustainability conference
        22-U.S. chip companies dominate world market                               Advertisement
        23-Global smartphone sales declined                          Air-CavityQFN? www.MirrorSemi.com
        24-Commerce Dept. gives Huawei “exemptions”


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          E-tec Inserat Socket 2015 190x127mm US.indd   1                                                  18.06.15   10:06
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