Page 1 - cover_july 062520aaaa.indd
P. 1

TM
                           TAP TIMESTM
                            Device Test, Assembly, Packaging & Emerging Technologies

                                            July 2020 - Volume 11, Number 6


        Get comfortable, and SEMICON West virtually this year

                                                                                                                 page 3

                                      A SEMICON West veteran refl ects on past shows
                                                                                                                page 15
                                                                                     Congress proposes

                                                                                $22.8B chip industry boost
                                                                                                                page 19































 TSMC plans advanced wafer fab for Arizona




 Chip assembly & packaging providers sustain upward trend in Q120




                                                                                                Fab equipment
                                                                                              spending record
                                                                                                    forecast

                                                                                                     for 2021
                                                                                                                page 31



                      BETTER BONDING
   HIGH POWER                                                             www.TanakaWire.com
                                                                           OFF THE SHELF



                       Made by
   1   2   3   4   5   6