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February 2019




        When are Kelvin sockets the “right”                     23-Mergers & acquisitions fell in 2018
                                                                25-Top 10 companies held 60% of market in 2018
        choice, Editor Ron Iscoff, 3                            26-Foxconn plans $9 billion chip plant
                                                                36-Virtual reality market worth $44.7B by 2024
        Advertisers, Events, 24                                 37-PC shipments declined slightly in Q418

        Business Cards, 27
                                                                EndPoints: Self-driving vehicles: Are

        Kelvin Socket Buyers’ Guide, 28-29                      we there yet? Ron Iscoff, 38
                                                                    Copyright © 2019 Test, Assembly & Packaging TIMES
        Technology unveiled at annual CES, 30
                                                                    Cover:  Autonomous vehicles, such as self-driving
        Physicists record lifetime of graphene                   cars are simply large, complicated robots.  AVs were the
                                                                  talk of this year’s CES show and are stirring up lots of
        cubits, 33                                                   interest from consumers and car makers.  P. 38

        NEWS
        6-Semiconductors passed 1 trillion shipped
        8-Can AI distinguish a bear from a can opener?                  Reach key industry buyers
        10-Intel reports 2018 revenue rose 13 percent                    with an ad in TAP TIMES!
        11-China leads in new fab projects
        13-China drove pure-play foundry growth
        14-Solar demand to reach new high                                  For a ratecard, contact
        16-Semiconductor revenue totaled $476B in 2018                      taptimes@email.com
        19-Non-volatile memory is making inroads
        20-Global GDP is a key IC growth driver
        21-IBM sets U.S. patents record again


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                                      • High reliability up to 500k insertion cycles
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                                      • Thru-hole technology, SMT, Solderless Type
                                        Also pluggable into adapter MiniGridSocket series (see E-tec catalog TS01)
                                      • All kinds of packages, even your latest special custom packages






                Flat Pack      PGA         LGA      Ceramic spatial  LCC          BGA      QFN / Power QFN  Custom
                  E-tec Interconnect AG, USA: Mr. Jared Wilson, TopLine, sales@topline.tv, 1-800-776-9888
            E-tec Interconnect AG, Mr. Bud Kundich, Los Altos CA 94024, USA, Phone : +1 408.746.2800, E-mail : info-us@e-tec.com
                            EP Patents 0897655, 1385011, 0829188, US Patents 6249440, 6190181, 6390826 and Patents in other countries

           E-tec Inserat Socket 2015 190x127mm US.indd   1                                               18.06.15   10:06
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