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HBP tap tmes advert _Layout 1  25/03/2013  08:45  Page 1

                 New Horizons in

                 Bond Testing

                 The Nordson DAGE 4000Plus is the most advanced

                 bondtester on the market, representing the
                 industry standard in bond testing.

                 Data Integrity
                 Developed by the world leader in bond testing technology,
                 the 4000Plus offers unsurpassed accuracy and repeatability
                 of data providing complete confidence in results.

                 Hot Bump/Pin Pull on the 4000Plus
                 A unique patent protected technique for attaching
                 a probe to solder bumps or paste and performing
                 a pull test in accordance with the IPC standard
                 IPC9708 pad cratering testing for surface mount
                 and printed board assemblies.
                 The 4000Plus HBP application is achieved by simply selecting a specialized
                 load cartridge which can be programmed to apply a temperature-time reflow
                 profile to individual bumps/bonds using a probe.  Pre-heating, soak, rate of
                 rise, liquidus and cooling are all integrated into the 4000Plus Paragon ™ software
                 for easy on screen profiling and control. A selection of standard probe sizes
                 are available with custom tips available on request.

                  SEE US AT BOOTH 5744, NORTH HALL, SEMICON WEST

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