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December 2018




        Much ado about China: Trade wars and                    Acknowledgements, 36
        keeping patents secret, Ron Iscoff, 3
                                                                EndPoints: Your new camera is now a
        Study opens route to ultra-low-power                    smartphone, Ron Iscoff, 37
        chips, 21
                                                                  Copyright © 2018 Test, Assembly & Packaging TIMES
        Events, Advertisers, 27

        Business Cards, 28-29


        Invisible activity seen by electron micro-
        scopes, 33

        NEWS
        15-Forecast: Outlook bright for auto electronics
        17-TestConX explores burn-in and test
        18-Q3 silicon shipments set quarterly record
        19-Samsung expected to extend its lead over Intel
        24-Micron appoints Bokan Sr. VP, worldwide sales
        24-Total NAND fl ash revenue rose by 4.4%
        30-Nordson Dage bondtester wins test award
        30-Strong growth seen for power electronics
        31-Only Qualcomm to show slight revenue decline
        35-Samsung’s CAPEX spending keeps pressure on







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