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TAP TIMESTM
                            Device Test, Assembly, Packaging & Emerging Technologies

                                           August 2020 - Volume 11, Number 7


              What Hong Kong’s loss of “special status” means

                                                                                                        page 3
                       SEMI forecasts record equipment sales in 2021
                                                                                               page 8
















       Analog Devices buys
       Maxim for $21 billion
                           page 11
          Advanced packaging market
          pegged at $42 billion in 2025
                                             page 20












 TSMC plans advanced wafer fab for Arizona




 Chip assembly & packaging providers sustain upward trend in Q120

















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