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TM
                           TAP TIMESTM
                              Device Test, Assembly, Packaging & Emerging Technologies

                                               April 2020 - Volume 11, Number 4



                                         High-tech hamburger:



                  Assembly & packaging for extreme environments (3)












           “Black Swan” event triggers                                              U.S. chipmakers keep
             chip forecast revision (14)                                                market lead (36)








































                          Graphene device is an
                     insulator/superconductor (38)





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